J-STD-001 NEWEST ACTUAL WITH QUESTIONS AND

J-STD-001 NEWEST ACTUAL / WITH QUESTIONS AND

100% VERIFIED SOLUTIONS. GRADED A+

Adhesive materials shall preclude the formation of the

acceptable solder connection for: - ---Answers---[D1D2D3]

Assemblies shall be sufficiently cooled after soldering

operations have been performed for: - ---Answers---

[D1D2D3]

Solder bath exposure periods shall be limited to an

appropriate duration for: - ---Answers---[D1D2D3]

Solder bath purity in machine soldering of PCBs shall be

maintained for: - ---Answers---[N1D2D3]

The manufacturer shall develop and maintain operating

procedures for the reflow soldering process for: - ---

Answers---[N1D2D3]

Exposed basis metal shall not prevent the formation of an

acceptable solder connection for: - ---Answers---[D1D2D3]

For heat shrinkable soldering devices wires shall overlap for >

3 conductor diameters for: - ---Answers---[D1D2D3]

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The solder shall wet the tinned portion of the wire and should

penetrate to the inner strands of the wire for: - ---Answers---

[N1D2D3]

Terminals and solder cups shall not be modified to accept

oversize conductors for: - ---Answers---[A1D2D3]

The rolled or flared area of the flange shall be free of missing

pieces and circumferential splits / cracks for: - ---Answers---

[D1D2D3]

The lead forming process shall not damage lead seals, or

welds for: - ---Answers---[D1D2D3]

Lead terminations in unsupported holes shall be clinched to a

minimum of 45 degrees for: - ---Answers---[N1N2D3]

Tempered leads shall not be terminated with a full-clinch

configuration for: - ---Answers---[D1D2D3]

Solder shall not touch a package body or end seal except for

plastic SOIC family for: - ---Answers---[D1D2D3]

Supporting objective evidence shall include SIR, historical

evidence or electrical testing results for: - ---Answers---

[N1D2D3]

• / 2